[M-bond 610] Vishay / 스트레인게이지 전용 고온용 접착제

스트레인 게이지용 본드 (Straingage Adhesive)

 

M-Bond 610 : 넓은 온도 범위에서 스트레스(stress) 분석 이용에 주로 사용되며 정밀 transducer 용으로 널리 사용됩니다.

 높은 온도에서 굳어지는 특성을 지닌 스트레인 게이지 전용 고온용 접착제 입니다.

 

 

 

 

Description

Two-component, solvent-thinned, epoxy-phenolic adhesive for high-performance applications,

including high-precision transducers.

Solids content 22%. Widest temperature range general-purpose adhesive available.

Low viscosity, capable of gluelines <0.0002 in [0.005mm].

Extremely thin, hard, void-free gluelines minimize creep, hysteresis, and linearity problems.

Cure must begin within four hours of application.

 

Characteristics

Operating Temperature Range:
Short Term: –452° to +700°F [–269° to +370°C].
Long Term: –452° to +500°F [–269° to +260°C].
Transducers: to +450°F [+230°C].

 

Elongation Capabilities:

1% at –452°F [–269°C];

3% at +75°F [+24°C];

3% at +500°F [+260°C].

Shelf Life:

Minimum 9 months at +75°F [+24°C]; or 15 months at +40°F [+5°C].

Pot Life:

6 weeks at +75°F [+24°C]; 12 weeks at +40°F [+5°C].

Clamping Pressure:

10 to 70psi [70 to 480kN/m2].

30 to 40psi optimum [200 to 275kN/m2].

Cure Requirements: 

Recommended Postcure:

2 hours at 50° to 75°F [30° to 40°C] above maximum operating temperature

or cure temperature, whichever is higher.

High Precision Transducer Postcure:

2 hours at +400° to +450°F [+205° to +230°C] after wiring.

 

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